While some semiconductor companies have put the brakes on 300mm-wafer production plans, Xilinx Inc. is driving the transition at full speed in an effort to make its high-end FPGAs more ...

Xilinx gets 130nm, 300mm production qualified at UMCNews from E-InSiteXilinx has announced production qualification for its 130nm Virtex-II Pro on 300mm wafers with fab partner United Microelectronics ...

Wireless chipmaker Qualcomm, and FPGA designers Altera and Xilinx have reduced their wafer start orders for the fourth calendar quarter of 2009 to their foundry partners, according to industry sources ...

Xilinx has started limited production of programmable logic on 300mm wafers at the Trecenti foundry, a joint venture between UMC and Hitachi. “We’ve past test. We shipped first wafers in December,” ...

To control costs, Xilinx, a US-based PLD (programmable logic device) manufacturer, could move the majority of its FPGAs (field programmable gate arrays) from 8-inch wafer production to a 12-inch ...

At the beginning of my career in semiconductor equipment, the backside of the wafer was a source of anxiety. In one memorable instance in my early career, several wafers flew off a robot blade during ...

Xilinx released its first 65-nanometer chip this week, following a trend among semiconductor makers to keep pace with consumer demands by using more advanced production techniques. Two requirements ...

IBM first foundry in the world to receive tape-out on 90nm from Xilinx; Next-generation Xilinx FPGAs planned for volume production next year EAST FISHKILL, N.Y. and SAN JOSE, Calif., December 16, 2002 ...

Claiming an industry first, Xilinx and TSMC have commenced volume production of the Virtex-7 HT family of heterogeneous 3d ics. The all programmable, 28nm devices were developed using TSMC's Chip on ...

San Jose chipmaker Xilinx Inc. has signed a two-year, $100 million agreement to use IBM's latest technology manufacturing facilities. The deal, to be announced today, means Xilinx's new Virtex-II ...