The high power density in turn produces large thermal gradients, with the low to max temperature changes increasing ...
Managing thermal and mechanical stress in multi-die assemblies will require a detailed knowledge of how and where a device will be used, how it will be packaged, and where stresses could cause ...
The semiconductor industry is turning to 3D integrated circuits (3D ICs) to meet increasing demands for high performance, miniaturization and energy efficiency. By stacking dies into 3D assemblies, we ...
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