Navitas Adds Top-Side Cooled QDPAK and Low-Profile TO-247-4L to its Package Line-Up in the Latest 5th Generation GeneSiC™ Technology

Thermal integration : Designed for easier system-level thermal integration via top-side cooling.
Seeking Alpha

Navitas Unveils 5th Generation SiC Trench-Assisted Planar (TAP) Technology

TORRANCE, Calif., Feb. 12, 2026 (GLOBE NEWSWIRE) -- Navitas Semiconductor (NVTS) (Nasdaq: NVTS), an industry leader in GaNFast™ gallium nitride (GaN) and GeneSiC™ silicon carbide (SiC) power ...
EDN

Navitas tightens SiC losses with refined TAP

Navitas Semiconductor has announced its 5th-generation GeneSiC platform featuring high-voltage trench-assisted planar (TAP) SiC MOSFETs, describing it as a significant advancement over previous ...
Nasdaq

Gogo Achieves Milestone with Successful First End-to-End Call Using Next-Generation 5G Technology

Gogo announces the successful completion of its first 5G end-to-end call, advancing air-to-ground connectivity for business aviation. Gogo has announced a significant milestone in its pursuit of ...